Contents:
Research within SCOOP Our overall goal of the programme is to develop III-V
semiconductor devices for optical signal processing in optical
networks at bitrates of 40 Gbit/s and beyond, where
electronics is expected to be extremely expensive or extremely
complicated compared to optical solutions. Further, the
integration of different types of devices can be expected in
the future because it will allow us to stay, to a higher
degree, in the optical domain, instead of frequently changing
back and forth between the optical and the electrical domain.
The all-optical solution will thus result in faster, less
complicated, and hence more elegant solutions to ultra-high
speed networking.
Functionalities that are currently pursued include:
- Optical add/drop multiplexing,
- Optical signal generation, including short-pulse
generation,
- Optical regeneration,
- Clock-recovery, and
- Wavelength conversion.
Interferometric structures of the Michelson and
Mach-Zehnder type as well as modulators of the
electro-absorption type will be explored for the achievement
of these functionalities. Also the mode-locked laser is a very
promising component for performing various functions in
all-optical networks, i.e. clock-recovery and demultiplexing.
The potential of low-dimensional structures (quantum dots
and quantum wires) for improving the device performance will
be assessed. The fabricated devices will be assessed in
systems test beds and to the extent possible they will go into
systems demonstrators.
Parallel to the experimental efforts on fabricated devices,
modeling is undertaken for device optimisation and for a more
complete understanding of the behaviour of devices in systems.
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Modeling We model
and analyze semiconductor devices for high-capacity optical
communication systems and networks, with a particular emphasis
on devices for optical signal processing. Our efforts comprise
projects spanning from basic materials physics, including
novel nanostructures, over active waveguides, to photonic
integrated devices and subsystems.
As the bitrate and the level of device integration
increases, further demands are placed on the correct physical
description of the devices. In order to assess the device
characteristics that are critical in system and network
applications, and in order to compare directly with the
outcome of systems experiments, it is important also to
develop simplified models and efficient numerical codes, which
allow simulation of real (sub)systems including, e.g., fiber
transmission.
At this point we have made extensive modeling of
Mach-Zehnder interferometers with respect to short switching
windows that can be used for demultiplexing of ultra-high
bit-rate OTDM signals.
We also have a working model that enables us to model and
design quantum well electroabsorption modulators to give the
desired properties such as high speed and high ssaturation
power combined with a small drive voltage. It is an extensive
model that takes the quantum mechanical effects of the quantum
wells into account (bound carriers, modified bandstructure
etc.).
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Fabrication and Processing
We have fabricated the first generation of
devices at the process facilities at GiGA. The semiconductor
material for these is all InP-based and the wafers have been
grown using the MOVPE facilities also at GiGA.
The devices are ridge waveguide devices and include lasers
and amplifiers with linear, non-linear and angled waveguides
as well as Michelson and Mach-Zender type interferometers, and
electroabsporption modulators.
The process include standard optical lithography to define
the ridges, the electrical isolation between contact pads, and
the pads themselves. Dry etch (RIE) followed by wet etch is
used to define the mesa for the ridges. The electrical contact
pads are realised through e-beam evaporation of various metals
onto the the samples. The wafer is then thinned to 100 µm and
metalised on the substrate side. After cleaving and AR
coating, the devices are separated and mounted using
sofisticated methods onto copper heatsinks for thermal
control. Tapered fibres or high NA lenses are then used to
couple light in and out of these components.
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Basic
Characterization The group is
internationally renowned within fundamental research on optics
and ultrafast dynamics of semiconductor nanostructures.
We use ultra-fast spectrally and temporally resolved
spectroscopy to determine basic properties of the devices.
Using pump-and-probe measurements, we are able to extract
important time constants, and to determine the overall quality
of our devices.
The time constants is important input to the modeling
group, which can then use this information to gain more
insight into the important processes taking place in the
devices.
The component activity is to a high extent systems driven
and performed together with the Systems
characterization part of SCOOP.
The research also concerns MBE-growth of high-quality
heterostructures forming low-dimensional structures like
quantum wells and quantum wires, and again we perform advanced
characterization of these structures with methods of high
spectral, temporal and spatial resolution. Our samples are
grown at the III-V Nanolab at the Niels Bohr Institute at the University of
Copenhagen.
Apart from the SCOOP devices, we currently focus on mainly
two areas:
- Growth and characterization of zero-dimensional quantum
dot systems
- Fabrication and characterization of all-optical or
optoelectronic components based on III-V semiconductors
The materials research activity has a more basic
nature. The research is aimed at improving and controlling the
properties of the materials used for various
telecommunications devices, as well as exploring entirely new
device concepts. This activity also offers high spatial
resolution (micro and nano optics) and temporal resolution
(femtosecond /terahertz) characterization tools to other
groups at COM.
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Systems Characterization
Very extensive research has been performed
within the field of Optical Time Division
Multiplexing (OTDM) for generating ultra-high bit-rate
signal at and in excess of 40 Gbit/s within the Systems Competence Area. To generate OTDM
signals, very high quality short pulse sources are required,
as well as high precision multiplexers. Typically, to generate
a 40 Gbit/s pulse train the maximum pulse width is ~10 ps and
the ratio between the center of the pulse and the pulse tail
power in the center of the adjacent pulse should be well in
excess of 20 dB to avoid a large impact from interferometric
cross-talk. Furthermore, as the channel separation is
performed in the time domain and not the wavelength domain,
active signal processing is a necessity to perform, e.g.,
demultiplexing.
The aim of SCOOP is to design and develop components for
ultra high bit-rate signal processing. The manufactured
components are aimed at the following applications:
- Semiconductor Optical Amplifiers (SOAs)
- wavelength conversion using cross-gain modulation
- demultiplexing using four wave mixing
- transmission impairment equalization by means of
optical phase conjugation
- Electroabsorption modulators
- external modulation of pulse-sources
- demultiplexing
- wavelength conversion using cross-absorption
modulation
- clock-recovery schemes
- Interferometric Michelson and Mach-Zehnder structures
- demultiplexing
- wavelength conversion using cross-phase modulation
To investigate the above components focus
areas experimentally, a test bed has been realized which in
principle consists of one or several sources (enabling WDM)
emitting 1-5 ps short pulses at wavelengths ranging from 1540
to 1560 nm at 10 GHz. These are modulated at 10 Gbit/s and
passively multiplexed up to a current maximum bit-rate of 80
Gbit/s. The resulting bit stream can then be transmitted over
a of length of fiber or fed directly to the receiver, where it
is demultiplexed optically and the BER assessed. Within the
test bed any device under test can be inserted anywhere or
replace any components giving a very large flexibility and
enabling a very large range of system experiments up to 80
Gbit/s. Research is now also focusing on the combination of
OTDM and WDM, hence increasing the flexibility in ultra-high
bit-rate systems.
The Systems Competence Area performs basic static
system related characterization of the manufactured devices
such as, e.g., gain versus input power (SOAs) and absorption
versus reverse bias (EAs). From these investigations device
behavior in larger system content is predicted and further
device optimizations are performed. After optimization and
further testing the components are implemented in the above
described larger system test bed for thorough assessment of
their dynamic performance. The device under test can be
inserted anywhere or replace any components in the test bed
giving a very large flexibility during the testing phase.
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